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Research literature / Conference paper

3D Terahertz Tomography for In-Situ Semiconductor Chip Inspection

J. Torniainen; K. Bertling; J. Silva; T. Gilliespie; L.H. Li; D Indjin; A.G. Davies; E.H. Linfield; P. Dean; A.D. Rakić

Published
Publisher
IEEE
Journal / collection
2025 50th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/irmmw-thz61557.2025.11319593

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J. Torniainen; K. Bertling; J. Silva; T. Gilliespie; L.H. Li; D Indjin; A.G. Davies; E.H. Linfield; P. Dean; A.D. Rakić. 3D Terahertz Tomography for In-Situ Semiconductor Chip Inspection. 2025 50th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz). 2025-08-17. https://doi.org/10.1109/irmmw-thz61557.2025.11319593

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