Skip to content
OPEN VARIABLE

Evidence-First Signal Intelligence

Menu

Research literature / Conference paper

Effective Build-Up Substrate Design for Warpage Reduction and Reliability Enhancement in Advanced Semiconductor Packages

Daichi Okazaki; Eiji Baba; Yuto Inoue; Daisuke Hironiwa; Ikumi Sawa; YoungGun Han; Taka Kanayama; Atsunori Hattori; Kanta Nogita; Ryo Miyamoto

Published
Publisher
IEEE
Journal / collection
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/ectc51687.2025.00148

Read the original source ↗

The original publisher provides the full text and its access options.

Cite this source

Daichi Okazaki; Eiji Baba; Yuto Inoue; Daisuke Hironiwa; Ikumi Sawa; YoungGun Han; Taka Kanayama; Atsunori Hattori; Kanta Nogita; Ryo Miyamoto. Effective Build-Up Substrate Design for Warpage Reduction and Reliability Enhancement in Advanced Semiconductor Packages. 2025 IEEE 75th Electronic Components and Technology Conference (ECTC). 2025-05-27. https://doi.org/10.1109/ectc51687.2025.00148

Download RIS