Reprocessable, Creep‐Resistant and Fully Biobased Thermosets for Power Semiconductor Packaging
Huarui Yao; Chang Jing; Aiqing Dong; Yanyun Li; Xiaoma Fei; Junying Zhang; Jiahao Ma; Jue Cheng
- Published
- Publisher
- Wiley
- Journal / collection
- Angewandte Chemie International Edition
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1002/anie.1898181
The original publisher provides the full text and its access options.
Cite this source
Huarui Yao; Chang Jing; Aiqing Dong; Yanyun Li; Xiaoma Fei; Junying Zhang; Jiahao Ma; Jue Cheng. Reprocessable, Creep‐Resistant and Fully Biobased Thermosets for Power Semiconductor Packaging. Angewandte Chemie International Edition. 2026-09-16. https://doi.org/10.1002/anie.1898181