Skip to content
Independent research & intelligence
OPEN VARIABLE

Evidence-First Signal Intelligence

Menu

Research literature / Preprint / posted paper

Digital Lean Six Sigma Across Vietnam's Electronics-Semiconductor Manufacturing Chain: Longitudinal Evidence from High-Mix Semiconductor-Equipment Contract Manufacturing

Ngoc Huy Mai

Published
Publisher
Springer Science and Business Media LLC
Research area
Semiconductors
Source type
Preprint / posted paper
DOI
10.21203/rs.3.rs-10941893/v1

Read the original source ↗

This is a preprint or other posted paper. Check the original source for its review and publication status.

The original publisher provides the full text and its access options.

Cite this source

Ngoc Huy Mai. Digital Lean Six Sigma Across Vietnam's Electronics-Semiconductor Manufacturing Chain: Longitudinal Evidence from High-Mix Semiconductor-Equipment Contract Manufacturing. Springer Science and Business Media LLC. 2026-09-09. https://doi.org/10.21203/rs.3.rs-10941893/v1

Download RIS