Progress and critical challenges in slicing of thin semiconductor wafers using ultra-fine diamond wire
Peiqi Ge; Zhecan Cao; Zongqiang Li; Peizhi Wang; Wenbo Bi; Mengran Ge; Wenkun Xie; Xu Xing
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Materials Science in Semiconductor Processing
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.mssp.2025.110209
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Cite this source
Peiqi Ge; Zhecan Cao; Zongqiang Li; Peizhi Wang; Wenbo Bi; Mengran Ge; Wenkun Xie; Xu Xing. Progress and critical challenges in slicing of thin semiconductor wafers using ultra-fine diamond wire. Materials Science in Semiconductor Processing. 2026-03. https://doi.org/10.1016/j.mssp.2025.110209