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Research literature / Conference paper

Topology Optimization for Embedded Cooling of Multiple and Transient Workloads in 3D Semiconductor Packages

Zekun Wu; Ashwin R Kidambi; Yu-Tao Yang; Chih-Ming Hung; Shurong Tian; Xin Zhang; Justin A. Weibel; Liang Pan

Published
Publisher
IEEE
Journal / collection
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/itherm55376.2025.11235689

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Zekun Wu; Ashwin R Kidambi; Yu-Tao Yang; Chih-Ming Hung; Shurong Tian; Xin Zhang; Justin A. Weibel; Liang Pan. Topology Optimization for Embedded Cooling of Multiple and Transient Workloads in 3D Semiconductor Packages. 2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). 2025-05-27. https://doi.org/10.1109/itherm55376.2025.11235689

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