Deep learning for robust optical overlay metrology in semiconductor device manufacturing
M. Lipp; L. de Wolf; A. den Boef; P. Forré; L. Amitonova
- Published
- Publisher
- SPIE
- Journal / collection
- Optics, Photonics, and Digital Technologies for Imaging Applications IX
- Research area
- AI & compute
- Source type
- Conference paper
- DOI
- 10.1117/12.3099114
The original publisher provides the full text and its access options.
Cite this source
M. Lipp; L. de Wolf; A. den Boef; P. Forré; L. Amitonova. Deep learning for robust optical overlay metrology in semiconductor device manufacturing. Optics, Photonics, and Digital Technologies for Imaging Applications IX. 2026-05-29. https://doi.org/10.1117/12.3099114