Die Bank Supermarket Strategy for Reducing Back-end Lead-time in Semiconductor Assembly and Test
Lewilyn P. Oben; Klint Allen A. Mariñas; Michael G. Calamba
- Published
- Publisher
- Avestia Publishing
- Journal / collection
- World Congress on Mechanical, Chemical, and Material Engineering
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.11159/icmie26.123
The original publisher provides the full text and its access options.
Cite this source
Lewilyn P. Oben; Klint Allen A. Mariñas; Michael G. Calamba. Die Bank Supermarket Strategy for Reducing Back-end Lead-time in Semiconductor Assembly and Test. World Congress on Mechanical, Chemical, and Material Engineering. 2026-09. https://doi.org/10.11159/icmie26.123