Hybrid Printed Electronics: Bonding Technologies and Manufacturing
P. Schmalen; F. Deboli
- Published
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Journal / collection
- IEEE Sensors Letters
- Research area
- Industrial systems
- Source type
- Journal article
- DOI
- 10.1109/lsens.2026.3703072
The original publisher provides the full text and its access options.
Cite this source
P. Schmalen; F. Deboli. Hybrid Printed Electronics: Bonding Technologies and Manufacturing. IEEE Sensors Letters. 2026-07. https://doi.org/10.1109/lsens.2026.3703072