Skip to content
Independent research & intelligence
OPEN VARIABLE

Evidence-First Signal Intelligence

Menu

Research literature / Conference paper

Diamond Thermal Solutions for Emerging High-Heat-Flux and High-Power Semiconductor Packaging

Yonhua Tzeng; Chun-Ping Lin; Ci-Jhen Fu; I-Lun Chiu; Ying-Yuan Huang; Pai-Chun Wei; Han-Ying Chen; Kueifeng Chiang

Published
Publisher
IEEE
Journal / collection
2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS)
Research area
Semiconductors
Source type
Conference paper
DOI
10.23919/icep-hbs69241.2026.11550587

Read the original source ↗

The original publisher provides the full text and its access options.

Cite this source

Yonhua Tzeng; Chun-Ping Lin; Ci-Jhen Fu; I-Lun Chiu; Ying-Yuan Huang; Pai-Chun Wei; Han-Ying Chen; Kueifeng Chiang. Diamond Thermal Solutions for Emerging High-Heat-Flux and High-Power Semiconductor Packaging. 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS). 2026-04. https://doi.org/10.23919/icep-hbs69241.2026.11550587

Download RIS