Thermal failure analysis in semiconductor devices through integrated multiphysics measurement and modeling
Yupu Li; Aoran Fan; Xiaoyu Zhang; Fengyi Li; Xing Zhang
- Published
- Publisher
- Elsevier BV
- Journal / collection
- International Journal of Heat and Mass Transfer
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.ijheatmasstransfer.2026.128541
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Cite this source
Yupu Li; Aoran Fan; Xiaoyu Zhang; Fengyi Li; Xing Zhang. Thermal failure analysis in semiconductor devices through integrated multiphysics measurement and modeling. International Journal of Heat and Mass Transfer. 2026-06. https://doi.org/10.1016/j.ijheatmasstransfer.2026.128541