A Novel Ultrahigh Current Whole-Wafer Press-Pack Power Semiconductor With Δ-Pack Structure
Xinling Tang; Zhongkang Lin; Jingfei Wang; Xiaoguang Wei; Guang Yang; Anqi Dai; Wei Hao; Yulin Gu; Yuhou Sun; Hao Shi
- Published
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Journal / collection
- IEEE Transactions on Power Electronics
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1109/tpel.2026.3670119
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Cite this source
Xinling Tang; Zhongkang Lin; Jingfei Wang; Xiaoguang Wei; Guang Yang; Anqi Dai; Wei Hao; Yulin Gu; Yuhou Sun; Hao Shi. A Novel Ultrahigh Current Whole-Wafer Press-Pack Power Semiconductor With Δ-Pack Structure. IEEE Transactions on Power Electronics. 2026-09. https://doi.org/10.1109/tpel.2026.3670119