Skip to content
Independent research & intelligence
OPEN VARIABLE

Evidence-First Signal Intelligence

Menu

Research literature / Conference paper

Development of Negative Thermal Expansion Fillers for Next-Generation Advanced Semiconductor Encapsulation Materials

Tetsuharu Yuge; Yutaro Tanaka; Kazuki Tsujikawa; Chie Matsunaga; Suresh Rao Nagendra Rao; Akihiro Oohara; Haruki Koshitouge; Masahiro Yokoyama

Published
Publisher
IEEE
Journal / collection
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/ectc51846.2026.00070

Read the original source ↗

The original publisher provides the full text and its access options.

Cite this source

Tetsuharu Yuge; Yutaro Tanaka; Kazuki Tsujikawa; Chie Matsunaga; Suresh Rao Nagendra Rao; Akihiro Oohara; Haruki Koshitouge; Masahiro Yokoyama. Development of Negative Thermal Expansion Fillers for Next-Generation Advanced Semiconductor Encapsulation Materials. 2026 IEEE 76th Electronic Components and Technology Conference (ECTC). 2026-05-26. https://doi.org/10.1109/ectc51846.2026.00070

Download RIS