Advancements in Semiconductor Assembly, Testing, and Packaging: A Global and Regional Perspective
- Published
- Publisher
- Seventh Sense Research Group Journals
- Journal / collection
- International Journal of Electronics and Communication Engineering
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.14445/23488549/ijece-v12i7p131
The original publisher provides the full text and its access options.
Cite this source
Seventh Sense Research Group Journals. Advancements in Semiconductor Assembly, Testing, and Packaging: A Global and Regional Perspective. International Journal of Electronics and Communication Engineering. 2025-07-31. https://doi.org/10.14445/23488549/ijece-v12i7p131