A Numerical Study on Die-Integrated Manifold Microchannel Heat Sinks Considering Transistor-Level Heat Dissipation of GaN Based MMIC Devices
Orcun Yildiz; Ali Kosar
- Published
- Publisher
- American Society of Mechanical Engineers
- Journal / collection
- ASME 2025 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1115/ipack2025-164114
The original publisher provides the full text and its access options.
Cite this source
Orcun Yildiz; Ali Kosar. A Numerical Study on Die-Integrated Manifold Microchannel Heat Sinks Considering Transistor-Level Heat Dissipation of GaN Based MMIC Devices. ASME 2025 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. 2025-10-28. https://doi.org/10.1115/ipack2025-164114