Deep learning-based prediction of warpage behavior in semiconductor packaging
Jaehee Shin; Jinhyoung Park
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- JMST Advances
- Research area
- AI & compute
- Source type
- Journal article
- DOI
- 10.1007/s42791-026-00130-x
The original publisher provides the full text and its access options.
Cite this source
Jaehee Shin; Jinhyoung Park. Deep learning-based prediction of warpage behavior in semiconductor packaging. JMST Advances. 2026-05-22. https://doi.org/10.1007/s42791-026-00130-x