Additive Manufacturing of Interposers with Curved Vias
Tobias A. Schaedler; Kayleigh A. Porter; Alex C. Yu; Souren Soukiazian; Trevor Sasse; Erin S. Wernick; Phuong P. Bui; Jacob M. Hundley; Mark R. O’Masta
- Published
- Publisher
- IMAPS - International Microelectronics Assembly and Packaging Society
- Journal / collection
- IMAPSource Proceedings
- Research area
- Industrial systems
- Source type
- Journal article
- DOI
- 10.4071/001c.147114
The original publisher provides the full text and its access options.
Cite this source
Tobias A. Schaedler; Kayleigh A. Porter; Alex C. Yu; Souren Soukiazian; Trevor Sasse; Erin S. Wernick; Phuong P. Bui; Jacob M. Hundley; Mark R. O’Masta. Additive Manufacturing of Interposers with Curved Vias. IMAPSource Proceedings. 2025-11-10. https://doi.org/10.4071/001c.147114