Sn-Decorated Boron Nitride Nanotubes Reinforced Liquid Metal Thermal Interface Materials for Semiconductor Packaging
Arni Gesselle M. Pornea; Numan Yanar; Duy Khoe Dinh; Thomas You-Seok Kim; You Been Goh; Min Seok Kwak; Jaewoo Kim
- Published
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Journal / collection
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1109/tcpmt.2025.3568785
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Cite this source
Arni Gesselle M. Pornea; Numan Yanar; Duy Khoe Dinh; Thomas You-Seok Kim; You Been Goh; Min Seok Kwak; Jaewoo Kim. Sn-Decorated Boron Nitride Nanotubes Reinforced Liquid Metal Thermal Interface Materials for Semiconductor Packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2025-10. https://doi.org/10.1109/tcpmt.2025.3568785