Hierarchical Blockchain for Mapping Manufacturing Process Flow
Timothy Kuo; Hui Yang
- Published
- Publisher
- IEEE
- Journal / collection
- 2025 IEEE 21st International Conference on Automation Science and Engineering (CASE)
- Research area
- Industrial systems
- Source type
- Conference paper
- DOI
- 10.1109/case58245.2025.11164079
The original publisher provides the full text and its access options.
Cite this source
Timothy Kuo; Hui Yang. Hierarchical Blockchain for Mapping Manufacturing Process Flow. 2025 IEEE 21st International Conference on Automation Science and Engineering (CASE). 2025-08-17. https://doi.org/10.1109/case58245.2025.11164079