Low-Temperature Femtosecond Laser Processing for Enhanced Via Hole Morphology in Semiconductor Packaging
Taesik Kim; Jaebeom Lee; Seon-Jin Chor; Jiyong Park
- Published
- Publisher
- IEEE
- Journal / collection
- 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.23919/icep-iaac64884.2025.11002974
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Cite this source
Taesik Kim; Jaebeom Lee; Seon-Jin Chor; Jiyong Park. Low-Temperature Femtosecond Laser Processing for Enhanced Via Hole Morphology in Semiconductor Packaging. 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC). 2025-04-15. https://doi.org/10.23919/icep-iaac64884.2025.11002974