Heat Transfer Enhancement by Metamaterial Structures for Semiconductor Cooling
Md Lokman Hosain; Orlando Girlanda; Saeed Maleksaeedi
- Published
- Publisher
- IEEE
- Journal / collection
- 2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/therminic65879.2025.11216932
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Cite this source
Md Lokman Hosain; Orlando Girlanda; Saeed Maleksaeedi. Heat Transfer Enhancement by Metamaterial Structures for Semiconductor Cooling. 2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). 2025-09-24. https://doi.org/10.1109/therminic65879.2025.11216932