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Research literature / Conference paper

Bonding Machine-Enabled Fine-Pitch Interconnects for Advanced Manufacturing

Ming Weng; Yu Zhang; Ranyuan Zhang; Yangbin Fang; Hualei Lu; Chengqiang Cui; Guannan Yang; Guanghan Huang

Published
Publisher
IEEE
Journal / collection
2025 26th International Conference on Electronic Packaging Technology (ICEPT)
Research area
Industrial systems
Source type
Conference paper
DOI
10.1109/icept67137.2025.11157060

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Ming Weng; Yu Zhang; Ranyuan Zhang; Yangbin Fang; Hualei Lu; Chengqiang Cui; Guannan Yang; Guanghan Huang. Bonding Machine-Enabled Fine-Pitch Interconnects for Advanced Manufacturing. 2025 26th International Conference on Electronic Packaging Technology (ICEPT). 2025-08-05. https://doi.org/10.1109/icept67137.2025.11157060

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