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Research literature / Conference paper

Multi Physics Field Coupling Modeling and Simulation for Reliability Prediction of Semiconductor Devices

Heng Tang; Haixiang Tang

Published
Publisher
IEEE
Journal / collection
2025 International Conference on Advances in Electrical Engineering and Computer Applications (AEECA)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/aeeca65693.2025.00076

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Heng Tang; Haixiang Tang. Multi Physics Field Coupling Modeling and Simulation for Reliability Prediction of Semiconductor Devices. 2025 International Conference on Advances in Electrical Engineering and Computer Applications (AEECA). 2025-08-22. https://doi.org/10.1109/aeeca65693.2025.00076

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