Density-aware multi-modal feature fusion for wafer map defect classification in semiconductor manufacturing
Wei Zhao; Yongkang Liu; Yuandong Gu; Xiupeng Shi
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- Journal of Intelligent Manufacturing
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1007/s10845-025-02713-2
The original publisher provides the full text and its access options.
Cite this source
Wei Zhao; Yongkang Liu; Yuandong Gu; Xiupeng Shi. Density-aware multi-modal feature fusion for wafer map defect classification in semiconductor manufacturing. Journal of Intelligent Manufacturing. 2025-10-30. https://doi.org/10.1007/s10845-025-02713-2