Thermodynamics-based sealing method for anodized aluminum used in semiconductor processing apparatuses
Yuhang Wang; Yang Zhao; Shaogang Wang; Ji Chen; Tao Zhang; Fuhui Wang
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Journal of Materials Science & Technology
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.jmst.2024.08.010
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Cite this source
Yuhang Wang; Yang Zhao; Shaogang Wang; Ji Chen; Tao Zhang; Fuhui Wang. Thermodynamics-based sealing method for anodized aluminum used in semiconductor processing apparatuses. Journal of Materials Science & Technology. 2025-05. https://doi.org/10.1016/j.jmst.2024.08.010