Investigation of Bamboo Powder Self-Adhesive Molding Method Using Semiconductor Laser for Additive Manufacturing
Kaito Tanaka; Reo Kitazaki; Nakahara Yutaro; Masao Nakagawa; Toshiki Hirogaki; Eiichi Aoyama; Hiromichi Nobe
- Published
- Publisher
- Trans Tech Publications, Ltd.
- Journal / collection
- Key Engineering Materials
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.4028/p-rhrh8o
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Cite this source
Kaito Tanaka; Reo Kitazaki; Nakahara Yutaro; Masao Nakagawa; Toshiki Hirogaki; Eiichi Aoyama; Hiromichi Nobe. Investigation of Bamboo Powder Self-Adhesive Molding Method Using Semiconductor Laser for Additive Manufacturing. Key Engineering Materials. 2025-05-16. https://doi.org/10.4028/p-rhrh8o