Near-field acoustic gripping for contactless semiconductor die handling
Yaoke Wang; Ziming Zhao; Yi Shi; Ping Guo
- Published
- Publisher
- Elsevier BV
- Journal / collection
- CIRP Annals
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.cirp.2026.04.022
The original publisher provides the full text and its access options.
Cite this source
Yaoke Wang; Ziming Zhao; Yi Shi; Ping Guo. Near-field acoustic gripping for contactless semiconductor die handling. CIRP Annals. 2026. https://doi.org/10.1016/j.cirp.2026.04.022