Review of non‑destructive testing technologies for semiconductor chip and circuit
Ziheng Jiang
- Published
- Publisher
- SPIE
- Journal / collection
- Third International Conference on Power Electronics and Artificial Intelligence (PEAI 2026)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1117/12.3111554
The original publisher provides the full text and its access options.
Cite this source
Ziheng Jiang. Review of non‑destructive testing technologies for semiconductor chip and circuit. Third International Conference on Power Electronics and Artificial Intelligence (PEAI 2026). 2026-04-17. https://doi.org/10.1117/12.3111554