Post-buckling solution of flexoelectric semiconductor cylindrical shell under multi-physical coupling load
Wei Wang; Gaofei Guan; Fenglin Liang; Lide Chen; Zhenhuan Zhou; Xinsheng Xu
- Published
- Publisher
- IOP Publishing
- Journal / collection
- Journal of Physics D: Applied Physics
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1088/1361-6463/ae2f6e
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Cite this source
Wei Wang; Gaofei Guan; Fenglin Liang; Lide Chen; Zhenhuan Zhou; Xinsheng Xu. Post-buckling solution of flexoelectric semiconductor cylindrical shell under multi-physical coupling load. Journal of Physics D: Applied Physics. 2025-12-31. https://doi.org/10.1088/1361-6463/ae2f6e