Dual-Mode 3D X-ray Imaging for Failure Analysis of Complex Semiconductor Packages
Jeff Gelb; Sheraz Gul; Chuyuan Zheng; Vikaram Singh; Anasuya Adibhatla; SH Lau; Sylvia Lewis; Wenbing Yun
- Published
- Publisher
- ASM International
- Journal / collection
- International Symposium for Testing and Failure Analysis
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.31399/asm.cp.istfa2025p0335
The original publisher provides the full text and its access options.
Cite this source
Jeff Gelb; Sheraz Gul; Chuyuan Zheng; Vikaram Singh; Anasuya Adibhatla; SH Lau; Sylvia Lewis; Wenbing Yun. Dual-Mode 3D X-ray Imaging for Failure Analysis of Complex Semiconductor Packages. International Symposium for Testing and Failure Analysis. 2025-11-16. https://doi.org/10.31399/asm.cp.istfa2025p0335