Intelligent Logistics in Semiconductor Manufacturing: AGV Path Planning Driven by 3D Spatiotemporal A* Algorithm
Xiaocan Chai; Runqi Chai; Senchun Chai; Xiaokai Qiu
- Published
- Publisher
- IEEE
- Journal / collection
- 2025 European Control Conference (ECC)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.23919/ecc65951.2025.11186935
The original publisher provides the full text and its access options.
Cite this source
Xiaocan Chai; Runqi Chai; Senchun Chai; Xiaokai Qiu. Intelligent Logistics in Semiconductor Manufacturing: AGV Path Planning Driven by 3D Spatiotemporal A* Algorithm. 2025 European Control Conference (ECC). 2025-06-24. https://doi.org/10.23919/ecc65951.2025.11186935