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Research on a multi-layered architecture-based dynamic visual verification system for physical layout of semiconductor cluster tool scheduling

Ke Ma; Hongbo Yang; Shijie Yu; Junjie Ye

Published
Publisher
SPIE
Journal / collection
International Conference on Internet of Things, Communication Engineering, and Artificial Intelligence (loTCEAI 2026)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1117/12.3122558

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Ke Ma; Hongbo Yang; Shijie Yu; Junjie Ye. Research on a multi-layered architecture-based dynamic visual verification system for physical layout of semiconductor cluster tool scheduling. International Conference on Internet of Things, Communication Engineering, and Artificial Intelligence (loTCEAI 2026). 2026-09-14. https://doi.org/10.1117/12.3122558

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