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Research literature / Conference paper

Sensitivity Analysis of the SMT2020 Testbed for Risk-Based Maintenance in Semiconductor Manufacturing

Philipp Andelfinger; Shuaibing Lu; Chew Wye Chan; Fei Fei Zhang; Boon Ping Gan; Jie Zhang; Wentong Cai

Published
Publisher
IEEE
Journal / collection
2025 Winter Simulation Conference (WSC)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/wsc68292.2025.11338982

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Philipp Andelfinger; Shuaibing Lu; Chew Wye Chan; Fei Fei Zhang; Boon Ping Gan; Jie Zhang; Wentong Cai. Sensitivity Analysis of the SMT2020 Testbed for Risk-Based Maintenance in Semiconductor Manufacturing. 2025 Winter Simulation Conference (WSC). 2025-12-07. https://doi.org/10.1109/wsc68292.2025.11338982

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