A power semiconductor chip rework technology without thermal and mechanical processes
Junha Baik; Byeongchan Kim; Ha-Young Yu; Myong-Gyu Lee; Dongjin Kim
- Published
- Publisher
- IEEE
- Journal / collection
- 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.23919/icep-hbs69241.2026.11550595
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Cite this source
Junha Baik; Byeongchan Kim; Ha-Young Yu; Myong-Gyu Lee; Dongjin Kim. A power semiconductor chip rework technology without thermal and mechanical processes. 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS). 2026-04-14. https://doi.org/10.23919/icep-hbs69241.2026.11550595