Optimization of Thermal Stress in High-Power Semiconductor Laser Array Packaging
Lei Cheng; Bingxing Wei; Xuanjun Dai; Yanan Bao; Huaqing Sun
- Published
- Publisher
- MDPI AG
- Journal / collection
- Electronics
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.3390/electronics14163336
The original publisher provides the full text and its access options.
Cite this source
Lei Cheng; Bingxing Wei; Xuanjun Dai; Yanan Bao; Huaqing Sun. Optimization of Thermal Stress in High-Power Semiconductor Laser Array Packaging. Electronics. 2025-08-21. https://doi.org/10.3390/electronics14163336