Anomaly Detection for Semiconductor Wafer Multi-wire Sawing Machines Using Statistical and Deep Learning Methods
Zhen-Yin Annie Chen; Chun-Cheng Lin; Hsin-Cheng Huang; Wen-Chieh Su; Cherng-Yow Cheng
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- Mobile Networks and Applications
- Research area
- AI & compute
- Source type
- Journal article
- DOI
- 10.1007/s11036-025-02477-2
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Cite this source
Zhen-Yin Annie Chen; Chun-Cheng Lin; Hsin-Cheng Huang; Wen-Chieh Su; Cherng-Yow Cheng. Anomaly Detection for Semiconductor Wafer Multi-wire Sawing Machines Using Statistical and Deep Learning Methods. Mobile Networks and Applications. 2025-08. https://doi.org/10.1007/s11036-025-02477-2