Bonding-Based Method to Prevent Contamination in Polymer Integration for Semiconductor Applications
Dong Yun Sung; Ji Yun Lee; Hyung-Jun Kim; Soeun Ahn; Min Ju Kim; Seung-heon Chris Baek; Jong Kyung Park; Sarah EunKyung Kim; Seul Ki Hong
- Published
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Journal / collection
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1109/tcpmt.2026.3681943
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Cite this source
Dong Yun Sung; Ji Yun Lee; Hyung-Jun Kim; Soeun Ahn; Min Ju Kim; Seung-heon Chris Baek; Jong Kyung Park; Sarah EunKyung Kim; Seul Ki Hong. Bonding-Based Method to Prevent Contamination in Polymer Integration for Semiconductor Applications. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2026-05. https://doi.org/10.1109/tcpmt.2026.3681943