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Research literature / Conference paper

Layer Thickness-Driven Optimization of Wafer Batching and Furnace Cleaning for Enhanced Semiconductor Processing

Matthias Heeg; Sonja Radler; Lucie Marx; Thomas Knief

Published
Publisher
IEEE
Journal / collection
2026 37th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/asmc69324.2026.11551273

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Matthias Heeg; Sonja Radler; Lucie Marx; Thomas Knief. Layer Thickness-Driven Optimization of Wafer Batching and Furnace Cleaning for Enhanced Semiconductor Processing. 2026 37th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC). 2026-05-11. https://doi.org/10.1109/asmc69324.2026.11551273

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