Assembly, Test, and Packaging (ATP) in Semiconductor Chips: A Comprehensive Survey
Vy Thi Thanh Huong; Viet-Thanh Pham; Tien V. Thai; Huu Q. Tran
- Published
- Publisher
- IEEE
- Journal / collection
- 2025 8th International Conference on Circuits, Systems and Simulation (ICCSS)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/iccss65911.2025.11081775
The original publisher provides the full text and its access options.
Cite this source
Vy Thi Thanh Huong; Viet-Thanh Pham; Tien V. Thai; Huu Q. Tran. Assembly, Test, and Packaging (ATP) in Semiconductor Chips: A Comprehensive Survey. 2025 8th International Conference on Circuits, Systems and Simulation (ICCSS). 2025-05-16. https://doi.org/10.1109/iccss65911.2025.11081775