Testing and Characterization for Semiconductor Packaging Thermal Management
Dongkai Shangguan; Chun Keang Ooi; Sze Pei Lim
- Published
- Publisher
- IEEE
- Journal / collection
- 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.23919/icep-hbs69241.2026.11550613
The original publisher provides the full text and its access options.
Cite this source
Dongkai Shangguan; Chun Keang Ooi; Sze Pei Lim. Testing and Characterization for Semiconductor Packaging Thermal Management. 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS). 2026-04-14. https://doi.org/10.23919/icep-hbs69241.2026.11550613