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Research literature / Conference paper

Detection of Defective Pad in Semiconductor Packaging Using Electro-Optic Sensor

Noriaki Yamada; Ryuju Sato; Mitsuru Shinagawa; Takahiro Uchida; Takahiro Kondo; Kunihiro Fujita; Shinji Ueyama; Ingi Kim; Takahiro Tokumiya

Published
Publisher
IEEE
Journal / collection
2026 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/icce-taiwan71481.2026.11652809

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Noriaki Yamada; Ryuju Sato; Mitsuru Shinagawa; Takahiro Uchida; Takahiro Kondo; Kunihiro Fujita; Shinji Ueyama; Ingi Kim; Takahiro Tokumiya. Detection of Defective Pad in Semiconductor Packaging Using Electro-Optic Sensor. 2026 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan). 2026-07. https://doi.org/10.1109/icce-taiwan71481.2026.11652809

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