Microscopic Insights into Strain and Failure Mechanisms in Advanced Semiconductor Packaging
Pawel Nowakowski; Richard Wei-Chih Li; Mary Ray; Paul Fischione
- Published
- Publisher
- Oxford University Press (OUP)
- Journal / collection
- Microscopy and Microanalysis
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1093/mam/ozaf048.978
The original publisher provides the full text and its access options.
Cite this source
Pawel Nowakowski; Richard Wei-Chih Li; Mary Ray; Paul Fischione. Microscopic Insights into Strain and Failure Mechanisms in Advanced Semiconductor Packaging. Microscopy and Microanalysis. 2025-07. https://doi.org/10.1093/mam/ozaf048.978