Evaluation of Heat Sink Geometries for Enhanced Thermal Dissipation in High-Power Semiconductor Devices
Rilwan Kayode Apalowo; Oladuwama Joel Owoloja; Samuel Olusina Famuyiwa; Joshua Ifedayo Kehinde; Elijah Oyebanji Oyeleke
- Published
- Publisher
- Trans Tech Publications Ltd
- Journal / collection
- Engineering Headway
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.4028/p-8jzc9s
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Cite this source
Rilwan Kayode Apalowo; Oladuwama Joel Owoloja; Samuel Olusina Famuyiwa; Joshua Ifedayo Kehinde; Elijah Oyebanji Oyeleke. Evaluation of Heat Sink Geometries for Enhanced Thermal Dissipation in High-Power Semiconductor Devices. Engineering Headway. 2026-02-12. https://doi.org/10.4028/p-8jzc9s