Toward robust structure function-based thermal analysis: Quantitative metrics for semiconductor packaging evaluation
Wonbin Song; Guesuk Lee; Byeng D. Youn
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Microelectronics Reliability
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.microrel.2025.115867
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Cite this source
Wonbin Song; Guesuk Lee; Byeng D. Youn. Toward robust structure function-based thermal analysis: Quantitative metrics for semiconductor packaging evaluation. Microelectronics Reliability. 2025-10. https://doi.org/10.1016/j.microrel.2025.115867