Embedded liquid cooling module for high-power semiconductor devices
Xiaobao Mo; Zhiping Yu; Mengting Guo; Haiyu Hua
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Applied Thermal Engineering
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.applthermaleng.2025.127168
The original publisher provides the full text and its access options.
Cite this source
Xiaobao Mo; Zhiping Yu; Mengting Guo; Haiyu Hua. Embedded liquid cooling module for high-power semiconductor devices. Applied Thermal Engineering. 2025-11. https://doi.org/10.1016/j.applthermaleng.2025.127168