Process Development of Copper Metallic Coating on Polished Silicon Wafers via Electroplating for Semiconductor Applications
Sung-Ki Min; Kyoung-Bo Kim; Moojin Kim
- Published
- Publisher
- The Korean Vacuum Society
- Journal / collection
- Applied Science and Convergence Technology
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.5757/asct.2025.34.6.188
The original publisher provides the full text and its access options.
Cite this source
Sung-Ki Min; Kyoung-Bo Kim; Moojin Kim. Process Development of Copper Metallic Coating on Polished Silicon Wafers via Electroplating for Semiconductor Applications. Applied Science and Convergence Technology. 2025-10-16. https://doi.org/10.5757/asct.2025.34.6.188