Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science
Ran Tao; Polette Centellas; Stian Romberg; Anthony Kotula; Gale Holmes; Amanda Forster; Christopher Soles; Robert Allen; Edvin Cetegen; William Chen; Jeffrey Gotro; Mark Poliks
- Published
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Journal / collection
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1109/tcpmt.2025.3603484
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Cite this source
Ran Tao; Polette Centellas; Stian Romberg; Anthony Kotula; Gale Holmes; Amanda Forster; Christopher Soles; Robert Allen; Edvin Cetegen; William Chen; Jeffrey Gotro; Mark Poliks. Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2025-10. https://doi.org/10.1109/tcpmt.2025.3603484