3D thermal analysis at transistor level based on IC layout files
Kaili Ding; Kai Sun; Maozheng Liu; Haihang Cui
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- Journal of Computational Electronics
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1007/s10825-026-02546-z
The original publisher provides the full text and its access options.
Cite this source
Kaili Ding; Kai Sun; Maozheng Liu; Haihang Cui. 3D thermal analysis at transistor level based on IC layout files. Journal of Computational Electronics. 2026-04-25. https://doi.org/10.1007/s10825-026-02546-z