A novel unified modeling of heat and moisture transport in a semiconductor containing spherical cavity
Sudip Mondal; Abhik Sur
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- Acta Mechanica
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1007/s00707-025-04618-w
The original publisher provides the full text and its access options.
Cite this source
Sudip Mondal; Abhik Sur. A novel unified modeling of heat and moisture transport in a semiconductor containing spherical cavity. Acta Mechanica. 2026-01-23. https://doi.org/10.1007/s00707-025-04618-w