A Review of Deep Learning Methods for Semiconductor Wafer Surface Defect Detection
Xinbo Hu; Hanguang Su; Sichao Xie; Xinpeng Wang
- Published
- Publisher
- IEEE
- Journal / collection
- 2026 International Annual Conference on Complex Systems and Intelligent Science (CSIS-IAC)
- Research area
- AI & compute
- Source type
- Conference paper
- DOI
- 10.1109/csis-iac70275.2026.11584951
The original publisher provides the full text and its access options.
Cite this source
Xinbo Hu; Hanguang Su; Sichao Xie; Xinpeng Wang. A Review of Deep Learning Methods for Semiconductor Wafer Surface Defect Detection. 2026 International Annual Conference on Complex Systems and Intelligent Science (CSIS-IAC). 2026-05-15. https://doi.org/10.1109/csis-iac70275.2026.11584951